Features :
0. Motorized Pcb Depaneling Machine_Pneumatically Driven FR4 MCPCB Separator Machine
1 . Separates PCBs with components located up to 0.5 mm from the score line
2 . Safe for use with flexible and thin PCBs
3 . Smooth , quiet pneumatic-powered unit with foot-pedal activation
4. Wedge-shaped linear blades contour to v-groove score lines and operate in a rocking motion
5. Boards are separated without bending or breaking
6 . No safety risks to operator since there is never a gap greater than 4 mm between the upper and lower blades
7 . Adjust blades to PCB score line using rotary knob
8. The machine was designed to depanel pre-scored panelboards carefully, without bending or tension stress.
9. Even sensitive SMD-Components like ceramic capacitors, will not be
damaged by the depaneling process, or thin board even to 0.3mm cab be
worked
10 . Separates boards up to 2.0 mm thick ( with minimum 0.5 mm scoring depth )
11 . Can be used with aluminum , FR4 , CEM3 and other substrates , including substrates with metal inner layers
Specification :
cutting length | 200 mm |
cutting thickness | 0.3-3.5 mm |
Machine size | 450*200*460mm |
Machine weight | 90 kg |
Model | YSVC-330 |
Features :
0. Motorized Pcb Depaneling Machine_Pneumatically Driven FR4 MCPCB Separator Machine
1 . Separates PCBs with components located up to 0.5 mm from the score line
2 . Safe for use with flexible and thin PCBs
3 . Smooth , quiet pneumatic-powered unit with foot-pedal activation
4. Wedge-shaped linear blades contour to v-groove score lines and operate in a rocking motion
5. Boards are separated without bending or breaking
6 . No safety risks to operator since there is never a gap greater than 4 mm between the upper and lower blades
7 . Adjust blades to PCB score line using rotary knob
8. The machine was designed to depanel pre-scored panelboards carefully, without bending or tension stress.
9. Even sensitive SMD-Components like ceramic capacitors, will not be
damaged by the depaneling process, or thin board even to 0.3mm cab be
worked
10 . Separates boards up to 2.0 mm thick ( with minimum 0.5 mm scoring depth )
11 . Can be used with aluminum , FR4 , CEM3 and other substrates , including substrates with metal inner layers
Specification :
cutting length | 200 mm |
cutting thickness | 0.3-3.5 mm |
Machine size | 450*200*460mm |
Machine weight | 90 kg |
Model | YSVC-330 |