Hot Bar Bonding machine-YSHP-1A
1.Closed Loop PID temperature control with visible LCD display.
2.LCD display programmable pressure switch for precise force control.
3.Each heating cycle is triggered by a real time pressure sensor.
4. Floating thermode ensures consistent pressure and heat transfer between
thermode head and the parts to be joined.
5. Silicon rubber can be fitted in bonding Heat Seal Connectors between LCD
and PCB.
6.Standard workpiece holder is mounted on a linear guideway and designed
to allow for easy changeover and repeatable operation.
7. Parts registration is adjusted by micrometer and secured by vacuum lock.
Optional CCD system for fine pitch component.
Specification:
Size
550×640×630mm
Working air pressure
0.50-0.70Mpa
Standard working area
110×150mm
Fixture
1 set
Temperature
0-400℃
Temperature precision
±2℃
Presssing time
0-99S
Thermode pressure
0.1-0.6Mpa
Weight
62Kg 
Hot Bar Bonding machine-YSHP-1A
1.Closed Loop PID temperature control with visible LCD display.
2.LCD display programmable pressure switch for precise force control.
3.Each heating cycle is triggered by a real time pressure sensor.
4. Floating thermode ensures consistent pressure and heat transfer between
thermode head and the parts to be joined.
5. Silicon rubber can be fitted in bonding Heat Seal Connectors between LCD
and PCB.
6.Standard workpiece holder is mounted on a linear guideway and designed
to allow for easy changeover and repeatable operation.
7. Parts registration is adjusted by micrometer and secured by vacuum lock.
Optional CCD system for fine pitch component.
Specification:
Size
550×640×630mm
Working air pressure
0.50-0.70Mpa
Standard working area
110×150mm
Fixture
1 set
Temperature
0-400℃
Temperature precision
±2℃
Presssing time
0-99S
Thermode pressure
0.1-0.6Mpa
Weight
62Kg
