Basic Description
The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.
Operation procedures
Wafer or Strip Tape mounting Dicing Cleaning UV seperation
Description of Auto dicing
Auto-dicing system, refers to a dicing system which all using full automatic operation from a series of processes of feeding, position calibration, cutting, cleaning / drying and unloading.
Main procedures
Feeding Position align Auto-dicing cleaning /drying Unloading automatically
automatically
1.Remove the dicing material automatically and transfer to the working platform from the magazine .
2.The dicing position align automatically.
3.Complete the dicing process of material automatically .
4.Use pure water and compressed air to clean and dry the dicingmaterial.
5.Sent the dicing material automatically to the magazine .
Applications
Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Ceramic substrate Silicon rubber Lead frame
Silicon wafer PCB Glass
Operating Requirements
1.Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.
2.Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.
3.Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃).
4.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.
5.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.
6.Please follow the product manual we provided for operation strictly.
Full Auto Dicing System YSL-2000AD Features of products
1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
2. Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
3. Can meet the high precision cutting maximum diameter of 300 mm materials.
4.Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
5.CCD automatic align.
6.Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
7.Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
8.Repeat positioning accuracy : 0.001mm
9.Cutting speed: 0.05 ~ 400 mm/sec
10.Each magazine can be stored 20 ~ 30 layers of frame.
11.Standard collocation of using blade size: 2 Inch(Max:3 Inch)
Processdescription
1.Mechanism remove it from magazine, and send it to the temporary table.
2.Unloading robot will move the dicing material tochunk.fordicing process.
3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
4.Unloading robot send material having been cleaned and dried to the temporarytable.
5.Robot send the dicing material to the magazine .
Case Sharing
| System compositionproject | Unit | Specification | |
| Dimensions of processing | mm | Φ300 | |
| Dimensions of working platform | mm | Φ350 | |
| X-axis | Working stroke | mm | 500 |
| Cutting speed | mm/sec | 0.05 ~ 400 | |
| Resolution | mm | 0.0001 | |
| Y-axis | Working stroke | mm | 650 |
| Resolution | mm | 0.0001 | |
| Repeat positioning accuracy | mm | 0.001 / 310 | |
| Z-axis | Working stroke | mm | 60 (2 Inch blade) |
| Resolution | mm | 0.0001 | |
| Θ-axis | Angle of rotation | Deg | 360 |
| Spindle | Power | KW | 2.4*2 set |
| Speed | Rpm | 5000 ~ 60000 | |
| Machine’s specifications | Power supply | V | 3P 220 (50 ~ 60 Hz) |
| Machine power | KW | 8 | |
| Power air pressure | MPa | 0.6 ~ 0.68 | |
| Air consumption | L/min | 250 | |
| Cutting water consumption | L/min | 6.5 | |
| Cooling water consumption | L/min | 2.5 | |
| Physical dimension | mm | 1262*1704*2023 | |
| Machine net weight | KG | 1900 | |
Other Discription
Optional equipment
1.Function of blade damage detection;
2.Automatic setting function;
3.Dicing visual function;
4. Using dicing blade with 3 Inch.
Ordinary 8 inch working platform can only put 2pcs material.
SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs material each time.
1.Reduce the loading times;
2.Meet the larger size of the product;
3.Promote more than 8% efficiency.
Basic Description
The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.
Operation procedures
Wafer or Strip Tape mounting Dicing Cleaning UV seperation
Description of Auto dicing
Auto-dicing system, refers to a dicing system which all using full automatic operation from a series of processes of feeding, position calibration, cutting, cleaning / drying and unloading.
Main procedures
Feeding Position align Auto-dicing cleaning /drying Unloading automatically
automatically
1.Remove the dicing material automatically and transfer to the working platform from the magazine .
2.The dicing position align automatically.
3.Complete the dicing process of material automatically .
4.Use pure water and compressed air to clean and dry the dicingmaterial.
5.Sent the dicing material automatically to the magazine .
Applications
Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Ceramic substrate Silicon rubber Lead frame
Silicon wafer PCB Glass
Operating Requirements
1.Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.
2.Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.
3.Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃).
4.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.
5.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.
6.Please follow the product manual we provided for operation strictly.
Full Auto Dicing System YSL-2000AD Features of products
1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
2. Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
3. Can meet the high precision cutting maximum diameter of 300 mm materials.
4.Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
5.CCD automatic align.
6.Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
7.Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
8.Repeat positioning accuracy : 0.001mm
9.Cutting speed: 0.05 ~ 400 mm/sec
10.Each magazine can be stored 20 ~ 30 layers of frame.
11.Standard collocation of using blade size: 2 Inch(Max:3 Inch)
Processdescription
1.Mechanism remove it from magazine, and send it to the temporary table.
2.Unloading robot will move the dicing material tochunk.fordicing process.
3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
4.Unloading robot send material having been cleaned and dried to the temporarytable.
5.Robot send the dicing material to the magazine .
Case Sharing
| System compositionproject | Unit | Specification | |
| Dimensions of processing | mm | Φ300 | |
| Dimensions of working platform | mm | Φ350 | |
| X-axis | Working stroke | mm | 500 |
| Cutting speed | mm/sec | 0.05 ~ 400 | |
| Resolution | mm | 0.0001 | |
| Y-axis | Working stroke | mm | 650 |
| Resolution | mm | 0.0001 | |
| Repeat positioning accuracy | mm | 0.001 / 310 | |
| Z-axis | Working stroke | mm | 60 (2 Inch blade) |
| Resolution | mm | 0.0001 | |
| Θ-axis | Angle of rotation | Deg | 360 |
| Spindle | Power | KW | 2.4*2 set |
| Speed | Rpm | 5000 ~ 60000 | |
| Machine’s specifications | Power supply | V | 3P 220 (50 ~ 60 Hz) |
| Machine power | KW | 8 | |
| Power air pressure | MPa | 0.6 ~ 0.68 | |
| Air consumption | L/min | 250 | |
| Cutting water consumption | L/min | 6.5 | |
| Cooling water consumption | L/min | 2.5 | |
| Physical dimension | mm | 1262*1704*2023 | |
| Machine net weight | KG | 1900 | |
Other Discription
Optional equipment
1.Function of blade damage detection;
2.Automatic setting function;
3.Dicing visual function;
4. Using dicing blade with 3 Inch.
Ordinary 8 inch working platform can only put 2pcs material.
SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs material each time.
1.Reduce the loading times;
2.Meet the larger size of the product;
3.Promote more than 8% efficiency.
