features:High Quality Multilayer PCB Depaneling
1, anti-dwelling structure design, there is no operational safety concerns.
2. Scythe work, suitable for various thickness MCPCB, the cutting stroke is below 2mm.
3. When the cutting is performed, the micro stress of the components is about 200, to avoid tin cracking and prevent damage of precision parts.
4, gas hybrid design, double straight knife slitting, especially suitable for dividing precision PCB board
5. When the cutting is performed, the micro stress of the components is about 200, to avoid tin cracking and prevent damage of precision parts.
6. The efficiency is 5~6 times faster than the traditional board machine.
7. Conveniently cut various COB substrates, bulb LED aluminum substrates, cob ceramic plates, etc.
8. For the pcb cutting equipment developed by COB light source board, the microcomputer is used to control the automatic feeding board.